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Passive Components News
DigiKey Adds 31k New In‑Stock Parts in Q1 2026
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new...
Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the...
Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs)...
Wk 17 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 4-24-26. DATAPOINTS OF THE WEEK: March new car registrations in Europe totaled...
Exxelia Introduces SMD High‑Voltage Mica Capacitors
Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers...
Modelithics Releases COMPLETE v26.1 for Keysight ADS
Modelithics has released version 26.1 of its Modelithics COMPLETE Library for Keysight Advanced Design System...
April 2026 Interconnect, Passives and Electromechanical Components Market Insights
Edgewater Research’s IP&E report suggests that the momentum for recovery is continuing to build and...
SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem
This article walks through the current state of Vishay's non-linear resistor (NLR) simulation toolkit and...
Würth Elektronik Expanded Capacity for Validation and Services in Asia
Würth Elektronik has significantly expanded its Asia Quality Design Center (QDC Asia) in Shenzhen, China,...
Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains
Samsung Electro-Mechanics has introduced a new range of ultra-high-voltage MLCCs in 1210 (3.2 × 2.5...
YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook
YAGEO, one of the world’s top three MLCC suppliers, is entering Q2 2026 with stronger...
TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters
TDK has introduced the B82722V6*B040 series of high‑voltage, current‑compensated ring‑core double chokes for DC bus...
Vishay Extends Power Inductors for DC/DC with 1212 Compact Case
Vishay’s new IHLP1212‑EZ‑1Z power inductors bring the well‑known IHLP low‑profile, high‑current technology into a very...
Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers
Planar magnetics are an attractive option for high‑density power converters thanks to their low profile,...
YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs
The new released APCA7045 ferrite shielded power inductors from YAGEO Group target modern high‑current DC‑DC...
Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications
Robots and humanoid robotic systems are rapidly transforming into sophisticated electromechanical systems. These systems often...
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Inter-connect, Electro-mechanical and Sensors
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Bourns Expands its Modular Contacts for Power-Dense Systems
Bourns has expanded its modular contacts portfolio with new five, six and eight amp versions addressing higher power delivery requirements...
Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
Samtec has expanded its AcceleRate Slim ARC6 high‑speed cable assembly family with new single‑ended and mixed signaling options targeting dense,...
Hirose Electric to Establish Automotive Connector Plant in India
Hirose Electric has announced plans to establish a new manufacturing site in Chennai, Tamil Nadu, India, with partial operations scheduled...
Binder Extends NCC Circular Connectors for Harsh Environments
Binder’s Not Connected Closed (NCC) circular connector family provides sealed, bayonet‑locking interfaces that remain protected even when unmated, targeting demanding...
Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard
The ratification of the ANSI/VITA 90 (VNX+) family of standards marks an important step for compact, rugged embedded systems that...
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Modeling Fringing Field Losses in Inductors & Transformers
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